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Hermetic Seals (Glass to Metal Seals)
Since the founding of the Durakool name over 70 years ago, our HermaSeal division has supported our Relay and Switch product line with in-house design and manufacturing of hermetic glass-to-metal seals, feed-throughs and metal-to-metal vacuum brazing. Requirements for unique and intricate seal components, which must withstand extreme challenges, are our speciality. Advanced, characteristics like:
● Ceramic-to-Glass bonding
● Metal-to-Metal brazing
● Glass-to-Metal sealing
Can all be done simultaneously using our proprietary processing. Our in-house capabilities continue to supply various niche applications with this core expertise; HermaSeal is here to support your needs.
HermaSeal is capable of manufacturing transistor packages, quartz crystal packages, housings for photodiodes, hybrid packages, diode housings, battery and power feed-throughs, sensor packages, microwave packages, and many other custom designs.
TYPES OF SEAL AVAILABLE |
STANDARD PRODUCT RANGES INCLUDE |
● Compression |
● TO-Series headers |
● Matched |
● Diode packages |
● Single pin |
● Feed-throughs |
● Multiple pins |
● Flange mounted packages |
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● Sight Seals Etc. |
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CUSTOM DESIGN
If you require an application specific hermetic seal or combination Glass/Ceramic/Metal assembly, HermaSeal would be pleased to provide engineering support with your design.
APPLICATIONS INCLUDE |
TECHNOLOGY ADVANTAGE |
● Opto-electronics |
● Excellent electrical insulation |
● Telecommunications |
● High hermeticity |
● Automotive Electronics |
● Pressure resistance |
● Pressure Sensors |
● Corrosion resistance |
● Battery Terminals |
● High operating temperature |
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● Mechanical strength |
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● Solderability |
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● Easy final assembly (i.e. welding or wire bonding) |
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● High reliability |
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TECHNOLOGY COMPARISON
COMPRESSION SEALS: The coefficient of thermal expansion of the header/seal body greatly exceeds that of both the glass and the electrode(s). The external metal component shrinks to form a compression ring around the glass. Assemblies of the available combinations are shown in the table below.
Typical compression seals will withstand extreme temperatures, in some cases -454o F (-270o C) to 842o F (450o C) with no loss in integrity.
MATCHED SEALS: The coefficient of thermal expansion of the metal components and the glass are similar. The hermetic seal is typically made by forming a bond between the glass and the oxide created on the metal components prior to sealing. Assemblies are available in the following combinations of materials:
Matched seals are more susceptible to temperature excursions, and are not recommended for applications exceeding 85o F (-65o C) to 482o F (250o C).
Material |
Compression Seal |
Matched Seal |
Header / Body |
● Cold Rolled Steel, Inconel, Stainless Steel |
● Kovar, Tungsten, Molybdenum |
Electrodes |
● 52 Alloy, Copper Cored 52 Alloy, 42 Alloy, 42-6 Alloy |
● Kovar, Tungsten, Molybdenum |
Glass |
● Alkali Barium, Lead Silicate, Potash Lead, Soda Lime |
● Borosilicate (Alkali, Barium, Soda, Potash) |
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Typical Characteristics offered by our seal assemblies
● Insulation resistance ranges from 1010 to 1012 Ohms.
● Breakdown voltage 40 VAC/55 VDC per radial .001 of glass between header and electrode
● Hermeticity 1.0 x 10-9 1.0 x 10-10Atm cc/sec (mbar l/s) He.
SURFACE FINISH
HermaSeal offer a variety of high quality surface finishes to meet the application requirements. These include but are not limited to:
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Material |
Advantages |
Electroless Ni |
● Good corrosion protection
● Good wire bonding
● Good solderability with flux
● Uniform thickness
● Good weldability |
Electrolytic Ni |
● Good corrosion protection
● Good solderability
● Excellent pre-plate for Au |
Pure Au flash |
● Improved solderability
● Protects against tarnish/oxidation |
Pure Au |
● Good wire bonding
● Excellent solderability without aggressive flux |
Hard Au |
● Wear resistant protection for contacts, plugs, connectors |
Ag – Silver |
● Excellent solderability
● High electrical conductivity |
Sn – Tin |
● Improved corrosion protection
● Very good solderability |
Cu – Copper |
● Good conductivity
● Excellent pre-plate for Ag |
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地址:台北市长安东路二段171号4楼之3 |
Address:4F-3. No.171. Sec.2. Chang An.E.Rd. Taipei. Taiwan. R.O.C. |
电话:(02)27111093~5 |
Tel:886-2-27111093~5 |
传真:(02)27310902, 27764624 |
Fax:886-2-27310902,27764624 |
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骏融企业有限公司 版权所有 © 2012 JIN ZON ENTERPRISE CO., LTD. All Rights Reserved.
TEL:886-2-2711-1093~5 FAX:886-2-2731-0902 ,2776-4624
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